This is the time for BGA machines in all types of reworking of PCB (printed circuit board) like microprocessor and motherboard of laptops, PC, play stations, Xbox and MP 4/5 players as it is the only machines best suitable for these types of reworking and the best thing is, it prevent the PCB for being overheating and due to this quality it is widely use everywhere.

There are so many types of BGA rework station available in the market having different specification according to size, quality, price, features and the size based on the product for which it is made. Rework or reworking is used for the replace and refurnishing operations and a repair of  a PCB (Printed circuit board) it is usually use for desoldering or resoldering of SMD (Surface mount device). The technique of Group processing is not applicable for the repair or replacement of a single device. Expert personnel use specialized manual techniques with appropriate equipment are required to replace defective components, BGA (ball grid array) machines usually need some extra expertise and appropriate tools like reballing kits to use. A hot air gun is used to provide more specific heat to the device and melt solder and specialized tools are used to pick and position small components, rework station is use to do these types of work.

This type of rework involves various types of components work on one by one without damaging other parts. Thermal pressure on the electric assembly make too low for avoiding unnecessary damages. Most of the soldering done with lead free solders, manufactured and assembled to avoid the health hazards of lead but this is not necessary lead solders melts at a low temperature. Heating a single SMD with hot air gun to melt all solders joints between the printed circuit boards is the first step before the removing of SMD then it cleared the previous solders from its surface and it is easy to remove by heating and melting temperature. The exact situation of the new unit onto the ready cushion exhibit requires skilful utilization of a remarkably precise vision-arrangement framework with high determination. The smaller the pitch and size of the segments, the more exact working must be. The newly placed SMD is soldered onto the board, Solder joints are encouraged by use of a solder profile which preheats the board, warms all the associations between the unit and the PCB to the softening temperature of the solder utilized, and then fittingly cools them. High quality demands or specific designs of SMD require application of solder paste before positioning and soldering the unit. The surface pressure of the liquid solder, which is on the board's bind cushions, has a tendency to force the mechanism into exact arrangement with the cushions if not at first positioned completely effectively.

BGA machines are widely use in today’s world for the rework and reballing of the chip based machines like microprocessor and motherboard of personal computers, laptops, PS3, plays station and Xbox. These are the best machines available for reworking at lowest cost preventing the PCB from overheating. A ball grid array (BGA) is a kind of surface-mount bundling utilized for incorporated circuits. BGA packages are utilized to forever mount devices, for example PCB. A BGA can furnish more interconnection pins than might be put on a double in-line or level bundle. The entire bottom surface of the device could be utilized, in place of simply the edge. The leads are additionally on normal shorter than with an edge just sort, accelerating better execution at high speeds.

Reballing Machines: Reballing includes dismantling and heating of the chips until it will remove from the printed circuit board (PCB) with a hot gun and a vacuum pickup tool. Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, evacuating the device, uprooting solder staying on the unit and board, putting new solder balls set up, reinstating the definitive mechanism if there was a poor association, or utilizing another one, and warming the mechanism or board to bind it set up. The new balls can be placed using different methods using a stencil for both the balls and the solder paste or flux also using a BGA preform with embedded balls corresponding to the device pattern and the using semi automated or fully automated machinery. The time is about 2 hours for the PS3 and Xbox mentioned above if everything happens well. Chips are always at high risks of being damage by the continuous heating and cooling applying on it and the warrant of the company do not apply on these types of damages also Evacuating solder with solder subject’s mechanisms to warm push fewer times than utilizing a streaming solder shower.

Fittingly completed rework restores the purpose of the reworked gathering, and it is resulting lifetime ought to not essentially be influenced. Hence, where the expense of revising is less than the quality of the get together, it is generally utilized within all areas of the electronic business. Producer and administration suppliers of correspondences innovations, excitement and purchaser gadgets, streamlined items, cars, restorative innovation, aviation and other high force hardware rework when fundamental.